BGA 共面度超标(Excessive Coplanarity of BGA)引发 PCB 变形(PCB Deformation),采用白光干涉仪测量方案
摘要球栅阵列封装(BGA, Ball Grid Array)焊球共面度(Coplanarity)超差是表面贴装技术(SMT, Surface Mount Technology)组装制程典型失效诱因。装配受力失衡会加剧印制电路板(PCB, Printed Circu…
2026/7/22 17:58:06