MT6765 PCB设计参考资料(MT6762/MTK6765安卓核心板画板规则)
Packaging
• Package outline of MT6765
• MT6765 footprint recommendation
• MT6765 ball out design
General Guidelines
• PCB stack-up recommendation
• Placement notes
Design Guidelines for High-speed Digital Signals
• LPDDR4X/LPDDR3
• PDN design
Others
• MT6765 RF interface - MT6177 (RF transceiver)
• MT6765 RF interface - MT6177M (RF transceiver)
• MT6357 (PMU)
• MT6631 (BT/FM/Wi-Fi/GPS)
• MT6371 (Battery charger/USB_PD)
• eMMC/USB/MIPI/SIM card/T-card
Package Outline of MT6765
MT6765 Footprint Recommendation
注意：
使用为所有焊锡垫定义的铜。
推荐的模具开口为0.24mm正方形，角为0.075R(见图2中的绿色区域)
利用0.1/0.22mm(钻/地)激光经上垫提高SMT的产率
MT6765 Ball Out Design
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